EPOXY RESIN MOLDING MATERIAL

摘要

PURPOSE:The titled molding material suitable for sealing semiconductor, having water-vapor resistance and reduced stress without lowering reliability in long- term heat-resistant test, obtained by blending an epoxy resin composition with a polyimide resin. CONSTITUTION:(A) An epoxy resin composition is blended with (B) a polyimide resin (preferably polyaminobismaleimide which is obtained by reacting an aromatic tetracarboxylic acid dianhydride with an aromatic diamine and has 70-120 deg.C softening point). The resin B is preferably prereacted with the resin A at 100-150 deg.C for 10-30min and added to a main material.