发明名称 ADHESIVE DISPENSING PUMP CONTROL SYSTEM AND PUMP
摘要 <p>An adhesive dispensing pump control system for automatically changing the flow rate of adhesive materials (15) being dispensed onto a workpiece (10) with an improved adhesive pump (14) in conformance with changes in movement of an automatically controlled adhesive dispensing nozzle (11) used to apply adhesive materials automatically onto the surface of a workpiece (10) in accordance with a predetermined pattern. The adhesive or other mastic dispensing pump control system operates to maintain substantially constant pressure across the dispensing pump (14) thereby making the system relatively insensitive to changes in viscosity of the adhesive (15) being dispensed and allowing adhesives to be dispensed at relatively high pressures.</p>
申请公布号 WO1987004951(A1) 申请公布日期 1987.08.27
申请号 US1987000258 申请日期 1987.02.12
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