| 摘要 |
PURPOSE:To simplify significantly the process for inserting and fixing lead pins into lead pin insertion holes of PGa substrate by a method wherein an insulating part is formed at least over the whole circumference of a part of each lead pin corresponding to the inside surface of each lead pin insertion hole. CONSTITUTION:A lead pin 7 consists of a head 7a and a stem 7b. The upper half of the stem 7b is covered completely with insulating material 8 over the whole circumference to form an insulating part A. The length (h1) of the insulating part A is somewhat longer than the thickness (h2) composed of a substrate 1, an insulating layer 2 and a circuit pattern 3 and the diameter (r1) of the insulating part A is a little larger than the inner diameter of a pin insertion hole 4. The lead pin 7 is pushed into the lead pin insertion hole 4 through the circuit pattern 3 and the insulating layer 2. As the insulating part A of the lead pin 7 is pushed into the hole 4 with tight fit condition, the insertion and fixing of the lead pin 7 is ensured. Moreover, as the length (h1) of the insulating part A is somewhat longer than the thickness (h2) composed of the substrate 1, the insulating layer 2 and the circuit pattern 3, the perfect electrical insulation between the substrate 1 and the lead pin 7 can be obtained. |
