| 摘要 |
PURPOSE:To contrive to enhance joint strength of a lead at manufacture of a hybrid integrated circuit device by a method wherein the lead to be fixed to a wiring substrate is made to have a main fixing part to be fixed to the wiring substrate facing to the flat surface loading no electronic parts of the wiring substrate, and an auxiliary fixing part to be fixed to the wiring substrate facing to the side of the wiring substrate, and the lead is fixed by the two places. CONSTITUTION:A lead 4 is consisting of a straight lead main body 6 to be inserted into a mother board 1, a main fixing part 7 arranged to the tip of the lead main body 6 thereof, and an auxiliary fixing part 8. The auxiliary fixing part 8 is constructed by forming two cuts respectively up to the middle from the edge of a rectangle part 9 broader than the lead main body 6 to divide the rectangle part 9 into three pieces, and by bending the center small piece at right angles. Accordingly, the main fixing part 7 and the auxiliary fixing part 8 confront with each other having the angle forming 90 deg.. The main fixing part 7 is fixed through solder 5 to a lead fitting pad 10 consisting of a metalized layer provided to the edge of the flat surface mounting no electronic parts 3, etc. of a wiring substrate 2. Moreover, the auxiliary fixing part 8 is fixed through solder 5 to a lead fitting pad 11 consisting of a metalized layer provided to the through hole inner wall surface of the edge surface of the wiring substrate 2. |
