| 摘要 |
PURPOSE:To obtain the confirmation of die bonding at a normal position simply and rapidly by a method wherein the picture data of either one of a semiconductor chip or a positioning mark is pattern-matched with a reference picture data while a reference point is set, a residual picture data s acquired from the reference point and positioning is decided. CONSTITUTION:A relay 36 is changed over to the contact B side, and the picture data of a positioning mark 11 is obtained. When the positioning mark 11 does not match with a reference picture data, the central point of the visual field of a camera 30 is shifted until the picture data of the positioning mark 11 is acquired. The central point is shifted through spiral movement in the X and Y directions from a predetermined starting point, but a displacement at a unit of mum is decided by the number of bits set of one shift, thus setting the tolerance of positional displacement by the number of shifts. No positional displacement is decided and confirmation is completed when the number of shifts is kept within requirement while positional displacement is decided and confirmation is ended when the number of shifts is brought to the outside of requirement.
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