| 摘要 |
PURPOSE:To enable lead fixing work having favorable workability and moreover having favorable reproducibility, and to strengthen joint strength of a lead to a wiring substrate by a method wherein the main fixing part and the auxiliary fixing part of the lead are fixed to the wiring substrate in the condition that the fitting part is engaged with one edge of the wiring substrate. CONSTITUTION:The main fixing part 7 and the auxiliary fixing part 8 of a lead 4 are so positioned as to make the parts thereof to be put on the lead fitting pads 10, 11 of a wiring substrate 2 mounting electronic parts, etc. After then, one edge of the wiring substrate 2 is inserted into the clip 22 of a lead frame 18, and the wiring substrate 2 is fixed temporarily to the lead frame 18 relatively. As a result, the main fixing part 7 and the auxiliary fixing part 8 of the lead 4 are made to face with the lead fitting pads 10, 11 of the wiring substrate 2. At this time, because a tie bar 21 performs spring action, the main fixing part 7 and the auxiliary fixing part 8 come in contact with the wiring substrate 2 elastically, and the main fixing part 7 and the auxiliary fixing part 8 are put on the lead fitting pads 10, 11 correctly and certainly. Thereupon, the main fixing part 7 and the auxiliary fixing part 8 are fixed to the lead fitting pads 10, 11 according to solder 5. |
