| 摘要 |
PURPOSE:To attach foreign matters such as dust to a layer consisting of a resin having tackiness as a foreign-matter bonding means on an upper package, and to improve the reliability of an electronic device without movement in a hollow section by previously applying said resin onto the inner circumferential surface of the upper package and assembling a package having hollow structure. CONSTITUTION:A ceramic seal type IC 1 is assembled in such a manner that a semiconductor chip 4 is bonded with a lower package 2, wires are bonded, an upper package 5 is superposed and both packages are welded by low melting- point glass 8, 9. A polyimide group resin 7 is applied previously to a recessed section 6 in the upper package 5 at that time. The upper package 5 is stacked onto the lower package 2. Since the viscosity of the polyimdie group resin 7 is adjusted properly however, the resin 7 does not drip. Dust, etc. in air adhere on the polyimide group region 7 during an assembly process, and the degree of cleanness in a hollow section A is improved. |
