| 摘要 |
PURPOSE:To prevent the generation of cracks in a passivation film and deformation of aluminum wiring, by forming, on the passivation film, a protection film for molding material. CONSTITUTION:After an oxide film 2, a phosphate glass 3 and an aluminum wiring 5a, 5b are formed on a substrate 1, a nitride film 4 as a passivation film is deposited by a plasma CVD method. An aluminum thin film 6 is formed on the nitride film 4 by sputtering. The pattern of a bonding pad portion is formed with a photo resist 9. The aluminum thin film 6 is eliminated by a wet etching, the nitride film 4 is eliminated by an anisotropic dry-etching, and the photo resist 9 is eliminated. Then, in the similar manner to a conventional process, wire bonding is performed in a wire bonding part, and mold packaging is performed.
|
