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发明名称
METHOD FOR MANUFACTURING A MULTILAYER WIRING FOR INTEGRATED SEMICONDUCTOR CIRCUITS HAVING AT LEAST ONE ALUMINIUM ALLOY LAYER WITH A CONTACT HOLE FILLING
摘要
申请公布号
EP0199030(A3)
申请公布日期
1987.08.26
申请号
EP19860102821
申请日期
1986.03.04
申请人
SIEMENS AKTIENGESELLSCHAFT BERLIN UND MUNCHEN
发明人
HIEBER, KONRAD, DR.;NEPPL, FRANZ, DR.;SCHOBER, KONRAD, DIPL.-PHYS.
分类号
H01L21/3205;H01L21/768;(IPC1-7):H01L21/90;H01L21/285
主分类号
H01L21/3205
代理机构
代理人
主权项
地址
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