EPOXY RESIN MOLDING MATERIAL FOR SEALING

摘要

PURPOSE:To form an epoxy resin molding material for sealing excellent in low stress, by adding a silicone resin powder to an epoxy resin. CONSTITUTION:An epoxy resin molding material for sealing contains a silicone resin powder. The silicone resin powder is a silicone resin having terminal functional groups (pref. alkyl, epoxy or amino groups). Pref. the silicone resin is used in an amount of 1-50wt% based on the total amount of the material. A silicone resin powder having a max. particle size of not larger than 50mu is preferred.