发明名称 |
TREATING APPARATUS |
摘要 |
PURPOSE:To utterly prevent pollution due to the back diffusion of oil vapor by using an oil-free vacuum pump as a vacuum pump which is used in a vacuum exhaust system of a reduced chemical vapor deposition device and subjecting its number of revolutions to feedback control of the degree of vacuum of a vacuum treating chamber. CONSTITUTION:A treating chamber 2 for semiconductor production is formed by a processed tube 1 made of quartz in a reduced chemical vapor deposition device and connected to a vacuum exhaust system 13 consisting of an oil-free vacuum pump 14 capable of controlling the number of revolutions by an invertor 16. This vacuum exhaust system 13 is provided with a controller 20 consisting of a computer or the like and it controls an invertor 16 and a heater 3 around the treating chamber 2 in basing on both the previously preset sequence and the measured data of the degree of vacuum in the inside of the treating chamber 2 due to a pressure measuring apparatus 19 and also controls the mass flow controllers 8a-10a and the valves 8b-10b of a gas feeding device 7 and thereby treatment forming a silicon film is performed on the wafers 31 set in the treating chamber 2 without causing an obstacle due to back diffusion such as oil vapor in the treating chamber 2. |
申请公布号 |
JPS62192583(A) |
申请公布日期 |
1987.08.24 |
申请号 |
JP19860032970 |
申请日期 |
1986.02.19 |
申请人 |
HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD |
发明人 |
MURAMATSU KIMIO;SATO AKIHIKO;KUSAKA TADAO;TOMIYAMA SHIGEO;SAKAMOTO HIROAKI;UEDA SHINJIRO;MASE MASAHIRO;OSAKABE ICHIRO;NAGAOKA TAKASHI |
分类号 |
B01J3/02;B01J3/00;C23C14/24;C23C16/24;C23C16/44;C23C16/455;C23F4/00;F04D19/04;H01L21/205;H01L21/302;H01L21/3065 |
主分类号 |
B01J3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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