| 摘要 |
PURPOSE:To impart water repellency to the surface of a substrate, by forming a plasma polymerization film on the surface of the substrate, roughening the polymerization film surface by etching and further forming a plasma polymerization film thereon. CONSTITUTION:A substrate 1 is set on a cathode electrode 11 in a vessel 13 and a silicone based or fluorine based monomer gas is introduced from a gas inlet 15. A high-frequency voltage is applied from an electric power source 14 across the electrons 11 and 12 to generate plasma and form a plasma polymer ization film 2 having about 0.1-2.0mu film thickness on the surface of the sub strate 1. After forming the polymerization film 2, the introduction of the mono mer gas is stopped and changed over to an etching gas, e.g. CH4, Ar, O2 or a mixed gas thereof, to roughen the surface of the polymerization film 2. The introduction of the etching gas is then stopped to reintroduce the monomer gas and form a plasma polymerization film 3 having about 0.1-0.5mu film thick ness on the polymerization film 2. Thereby the aimed coat having improved water repellency is readily formed on the surface of the substrate 1 with good stability.
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