| 摘要 |
PURPOSE:To uniformly remove the release agent adhered to a surface to be printed without preparing a washing tank or providing a washing process, by mounting a flame irradiation apparatus for irradiating the surface to be printed of a molded resin product with a flame on the way of the feed of the molded resin product prior to printing. CONSTITUTION:The semiconductive device 1 fed on a rail 2 by a feed pawl 4 passes under flame 8 emitted from a torch 5 prior to printing. Because of this, the surface 1a to be printed of the semiconductive device 1 is exposed to the flame 8 to burn and evaporate the release agent adhered to the surface 1a to be printed. Because the lead part 1b of the semiconductive device 1 is covered with a rail cover 3 to be protected thereby, said lead 1b is not exposed to the flame 8. |
