| 摘要 |
<p>PURPOSE:To improve electric insulation by applying a liquid photosensitive resin compound to a photomask, semi-curing it by active beams, laminating said liquid photosensitive resin compound with a printed circuit board so as to irradiate active beams from a mask side and removing the photomask and uncured part. CONSTITUTION:The liquid photosensitive resin compound 1 is directly applied to the photomask 2 or through a transparent film 3. Then active beams are irradiated through the photomask 2 to semi-cure the photosensitive resin compound 1. Plural compounds 1 are laminated so as to overlap with each other on the surface of the printed circuit board 4 where said compound 1 is coated on the surface. After active beams are irradiated from the side of the photomask 2, a thing obtained by separating the photomask 2 or, the transparent film 3 and the photomask 2 from the laminated cured body is cleaned with a dilute alkali solvent, whereby the uncured part of the liquid photosensitive compound 1 is removed.</p> |
