发明名称 |
A RESIN FILLER |
摘要 |
<p>According to the invention, a filler for an electronic element encapsulation resin composition is provided. The filler comprises 5 to 95 parts by weight of fused silica beads of generally spherical form and 95 to 5 parts by weight of crushed particles of fused silica of rugged form. The resin composition admixed with the filler has excellent fluidity without the formation of burs when molded.</p> |
申请公布号 |
GB2151600(B) |
申请公布日期 |
1987.08.19 |
申请号 |
GB19840028726 |
申请日期 |
1984.11.14 |
申请人 |
* DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
AKIRA * KABAYASHI;RYOICHI * IDE;HIROTAKA * KOGA |
分类号 |
C08K3/00;C08K3/34;C08K3/36;C08K7/00;C08K7/16;C08K7/18;C08K7/20;C08L63/00;C08L67/00;C08L87/00;C08L101/00;H01L23/29;H05K3/28;H05K7/00;(IPC1-7):C01B33/12 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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