| 摘要 |
PURPOSE:To enhance the efficiency of an integrated circuit by arranging first and second pads on the front and back surfaces, forming open holes on the front and back surfaces of a package, and connecting wirings from both front and back surface sides to increase pins for inputting and outputting signals to one package. CONSTITUTION:Pads 5 arranged on the front surface side are connected with pins 12 by a pattern 1C and a conductor 13, and pads 5 arranged on the back surface side are connected with pins 12 by a pattern 1D and a conductor 13. Accordingly, a wire bonding is performed on the front surface side by an open hole 1A, and on the back surface side by an open hole 1B. The wire bonded front surface side has a structure in Fig. a, and the back surface side has a structure in Fig. b. In this case, a first pad 3 cannot be formed at a position to be bonded with a projection 1E different from the wire bonding of the front surface side, but since the first pad 3 can be arranged on the other portion, pins 12 for inputting and outputting signals can be doubled. |
