发明名称 |
Integrated circuit having a pre-attached conductive mounting media and method of making the same |
摘要 |
A semiconductor wafer having a plurality of integrated circuits is provided. One surface of the wafer includes a plurality of electrical contacts on the circuits which are subsequently attached to leads. The other surface of the wafer is provided with a conductive tape. The wafer is cut, e.g., sawed, resulting in each individual circuit having a pre-attached conductive mounting media. The individual circuits can then be attached to a substrate through the conductive mounting media. Other embodiments are disclosed.
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申请公布号 |
US4688075(A) |
申请公布日期 |
1987.08.18 |
申请号 |
US19830516019 |
申请日期 |
1983.07.22 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
PHY, WILLIAM S. |
分类号 |
H01L21/58;H01L21/60;H01L23/14;H01L23/482;H01L23/495;(IPC1-7):H01L39/02 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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