发明名称 Apparatus for selectively plating electrical terminals
摘要 An apparatus for plating interior surfaces of essentially flat electrical terminals that are spaced apart and attached to a carrier strip is disclosed. The apparatus is comprised of strip feeding means which feeds the strip (120) of terminals (122) to a rotating mandrel (10) which guides the terminals (122) through a plating zone while they are plated, a source of electrolytic plating solution, and a source of electrical potential for applying electrical current flow from the anode (42) through the solution to a cathode. The mandrel (10) has a plurality of nozzles (62) located about its axis of rotation, and a plurality of anode extensions (64), each anode extension (64) being mounted in an associated nozzle (62), such that one end of the anode extension (64) protrudes outwardly from the end of the nozzle (62). The strip (120) of terminals is fed to the mandrel (10) so that the interior contact zone (128) of the terminals (122) are aligned with and mounted over the protruding end of the corresponding anode extensions (64). A conduit (56) supplies electrolyte solution under pressure through the nozzles (62) and into the terminals (122) in which the associated anode extensions (64) have been received. The terminals (122) are removed from the anode extensions (64) as the strip (120) exits the mandrel (10).
申请公布号 US4687555(A) 申请公布日期 1987.08.18
申请号 US19860929044 申请日期 1986.11.10
申请人 AMP INCORPORATED 发明人 SMITH, MARK L.
分类号 C25D5/02;(IPC1-7):C25D5/02;C25D17/00 主分类号 C25D5/02
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