| 摘要 |
PURPOSE:To accomplish the handling of a package level at a chip level by a method wherein anisotropic conductive grains are dispersively arranged in a transparent molding material of elasticity, and the entire chip is enveloped by the molding material. CONSTITUTION:A semiconductor chip 2 is entirely molded uniformly by casting, and it is formed into the shape of a primary package, which can be handled easily, using a transparent elastic sealing agent 1. To be more precise, a primary molding is performed on the entire chip in the thickness of 30-50mum using a casting M/C. As a result, the Si chip is protected both electrically and mechanically, because it is not exposed to outside. Also, as said molding agent is transparent and elastic, the IC chip located in the sealing agent can be clearly seen from outside, and its positioning can be performed easily. |
