发明名称 TRANSFERRING APPARATUS FOR SEMICONDUCTOR WAFERS
摘要 PURPOSE:To obtain a compact and simple automatic wafer transferring apparatus having a high transfer speed and enabling the execution of monitor wafer processing (for a sheet), by providing a chuck for badge transfer and a chuck for sheet transfer respectively in the ends of an arm projecting from a rotating shaft onto the opposite sides thereof and having the same rotational radius. CONSTITUTION:A chuck 8 for sheet transfer having a groove capable of holding a sheet of wafer and a chuck 9 for badge transfer having a plurality of grooves capable of holding several sheets of wafers simultaneously are provided in the opposite ends of an arm fitted to a rotating shaft 6 rotatably and movably in the vertical direction, and at positions equal in distance from the rotating shaft 6. The chuck 9 for badge transfer is moved to a position just above a cassette 3 positioned at a distance equal to the chuck from the rotating shaft, by rotating the rotary arm 7, and then the chuck 9 is lowered. Wafers 2 in the cassette 3 are lifted beforehand by a thrust comb 12, and they are held together in a plurality of sheets (one badge) by closing the chuck 9. When it is necessary to transfer wafers by sheets, the chuck 8 for sheet transfer provided on the opposite side of the rotary arm is used.
申请公布号 JPS62188335(A) 申请公布日期 1987.08.17
申请号 JP19860031310 申请日期 1986.02.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSUTAHARA KOUICHIROU
分类号 H01L21/677;H01L21/67;H01L21/68 主分类号 H01L21/677
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