| 摘要 |
PURPOSE:To enable a semiconductor wafer to be held by a sufficient suction force of a vacuum even if the semiconductor wafer is warped or defects such as cracks or the like are produced on the wafer carrying surface of a chucking apparatus for carrying the wafer, by providing vacuum suction paths opened in projected regions of the wafer carrying surface surrounded by grooves such that those section paths give a direct suction effect. CONSTITUTION:Second vacuum suction paths 6 are provided within a wafer carrying section 2. When a vacuum is drawn, insides of recessed grooves 4 and 5 are wholly evacuated through a suction path 3 and a semiconductor wafer 10 is sucked by the vacuum present in the spaces of the grooves. In addition thereto, said vacuum suction paths 6 are provided so as to independently act on respective projected regions of the surface of the wafer carrying section 2 so that the suction effect as a whole is enhanced by that much. Further, the suction of the suction paths 6 functions sufficiently, even if the vacuum within the grooves 4 and 5 is nullified by warpage of the semiconductor wafer 10 for example. Accordingly, even if a motor 13 is driven with the wafer 10 sucked insufficiently by means of the vacuum in the grooves 5 and 6 and a chucking apparatus is rotated rapidly, the semiconductor wafer 10 can be effectively prevented from being deviated from the center of slipping out of the wafer carrying section 2.
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