| 摘要 |
PURPOSE:To enable a bonding unit to form good bonds with desirable strength and reliability even on a heat-resisting substrate, by applying laser beams to a bonding section for heating it directly. CONSTITUTION:A laser generating apparatus 30, which is a YAG laser in this embodiment, is provided so as to apply a laser beam to each of bonding pads on a semiconductor 61. Further, a temperature detecting apparatus 40 is provided for detecting a temperature of the region of the bonding pad to which the laser beam has been applied. The temperature detecting apparatus 40 is composed of a infrared radiation generating section for applying infrared rays to the that region to which the laser beam has been applied and of a temperature detecting element formed of In-Sb for receiving the infrared rays reflected therefrom. A television camera 20, the laser generating apparatus 30, the temperature detecting apparatus 40 and a body 10 are all connected to a control unit 50 so that, for example, an output of the laser generating apparatus 30 is controlled based on a temperature detected by the temperature detecting apparatus 40 or a bonding head is positioned reciprocally or transversely according to the position of the bonding pad recognized by the television camera 20. |
