发明名称 MULTILAYER SHEET COIL
摘要 PURPOSE:To make a connection easy by providing a dummy terminal which is not connected to a coil pattern other than a regular terminal which is connected to the coil pattern in a sheet, by using the dummy terminal in the connection of the regular terminal and the wiring pattern of a printed wiring substrate and by making the surface of the terminal the state of a recession and a projection. CONSTITUTION:The first terminals 11a, 12b, 13c, 11d-13d connected to a coil pattern 14 and the second terminals 11b, 11c, 12a, 12c, 13a, 13b which are not connected to the coil pattern 14 are provided in sheets 11-13. The surfaces of the first terminals and the second terminals are made the state of a recession and a projection and the first terminal of one sheet separated from a printed wiring substrate 16 is connected to the required wiring pattern of the printed wiring substrate 16 via the second terminal of the other sheet. Since the surfaces of the terminals are made the state of a recession and a projection, e.g., when a connection is made with a conductive paste, the conductive paste is held in the recession and is not made flow out in a pressurizing process, the contact area of the conductive paste is increased and the reliability of the connection is improved.
申请公布号 JPS62188201(A) 申请公布日期 1987.08.17
申请号 JP19860029681 申请日期 1986.02.13
申请人 SONY CORP 发明人 OSAWA KENJI;MURAMOTO SHOICHI;WATANABE YOSHIO;KAWAHARA TAKANORI;KOIZUMI TAKAAKI
分类号 H01F5/00;H02K3/26;H02K3/50;H02K5/22;H05K1/14 主分类号 H01F5/00
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