发明名称 TWO-STAGE MOLDED POLYAMIDE RESIN
摘要 PURPOSE:To make it possible to improve remarkably the cohesive force at the boundary of contact between a primary molding part and a secondary molding pat, by using a specified mixed polyamide resin as at least ether of the primary and secondary parts of a two-stage molded polyamide resin. CONSTITUTION:This two-stage molded polyamide resin is composed of primary and secondary molding parts of a polyamide resin. As the polyamide resin for a primary and/or secondary molding parts, a composition formed by mixing 100pts.wt. polyamide 12 resin with 10-235pts.wt. polyamide 12/6 copolymer is used. As the polyamide 12/6 copolymer, one comprising 100pts.wt. polyamide 12 component and 10-40pts.wt. polyamide 6 component is desirable. It is particularly desirable in respect of adhesion that said polyamide resin mixture is used as the primary molding part and a polyamide 12 resin is used as the secondary molding part. Examples of said two-stage molding include soles of shoes.
申请公布号 JPS62187734(A) 申请公布日期 1987.08.17
申请号 JP19860028798 申请日期 1986.02.14
申请人 UBE IND LTD 发明人 TOMINAGA TAKASHI;TSUMIYAMA TATSUO;NAKAGAWA KENICHI
分类号 C08J5/00;A43B13/04;C08J5/12 主分类号 C08J5/00
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