| 摘要 |
PURPOSE:To contrive the improvement in working efficiency by aligning and determining the plane coordinates of a probe card and a wafer by using a first wafer when a number of wafers of the same kind are measured so as to utilize the resultant data for the measurements thereafter. CONSTITUTION:A wafer 11 is positioned in advance and is set on a table 2 which is movable in X and Y-directions. Furthermore, it is positioned precisely by rotating the table precisely and it is moved under probes 4 of a probe card 3. At this time, the probe card 3 is fixed to a card holder 5. Then, the table 2 is raised to bring electrode pads of a wafer chip close to points of the probes and while the relation of the probe points and the pads is observed through a microscope, the table 2 is rotated by the array of probe points as a reference to bring the all probe points in accordance with the pads. A correcting circuit angle of the wafer at that time is made theta and it is memorized in a microcom puter together with X and Y positions at that time by making them plane coordinates is a slip angle of the probes of the placed card and the table 2 carrying the wafer is moved only by theta.
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