METHOD AND APPARATUS FOR COATING

摘要

PURPOSE:To apply a coating liquid on the main surface of a wafer by one stamping operation by bringing a coating body impregnated with the coating liquid into contact with the entire region of the surface to be coated of the wafer. CONSTITUTION:The porous coating body 2 such as sponge impregnated with the coating liquid 1 such as photoresist is pressed onto the main surface which is the surface to be coated of the wafer 3 in the stage of applying the coating liquid such as photoresist on a thin large-diameter semiconductor sheet in particular so as to be brought into contact therewith by a method such as stamping. The coating liquid 1 impregnated to the coating body 2 is thereby applied on the main surface of the wafer 3. The coating liquid is thus applied over the entire main surface of the wafer 3 by one stamping operation of the coating body 2 to the wafer 3, by which a coating film 4 is formed and the workability is improved.