发明名称 INSPECTING INSTRUMENT FOR IC PACKAGE PIN
摘要 PURPOSE:To inspect precisely the curvature of a pin of an IC package by arranging electrode groups on a substrate in conformity with pin gaps of the IC package, and providing a power supply circuit and a current detecting circuit for each electrode in the electrode group. CONSTITUTION:An inspecting instrument is provided with electrode groups 300 of electrodes 301-319 as many as pins on an elastic substrate 400 in conformity with pin gapa of the IC package, and power supply circuits 201-204 and current detecting circuits 101-104 are provided for the respective electrodes. Then, when the pins of the IC package are so arranged that, for example, the electrodes 303 and 306 short-circuit with each other, a current path consisting of the circuit 201, circuit 101, electrode 303, electrode 306, circuit 102, and circuit 202 is formed and the flow of a current is detected by the circuits 101 and 102. If a pin of the IC package is curved, a current path is formed at a part in the electrode group 300 corresponding to the pin which has a different position relation with parts in other electrode groups 300 and this difference is confirmed by monitoring the respective current detecting circuits.
申请公布号 JPS62187261(A) 申请公布日期 1987.08.15
申请号 JP19860030026 申请日期 1986.02.13
申请人 NEC CORP 发明人 TAKANO SEIJI
分类号 H01L21/66;G01R31/02 主分类号 H01L21/66
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