发明名称 MOLDED STRUCTURE OF WIRE BONDING PART
摘要 PURPOSE:To secure the practical strength of a molding material, by using a hard molding agent at a direct contact part to a bonding part, and using a soft molding agent at the exposed part of wire. CONSTITUTION:Wire is pushed and connected in bonding. Therefore, the shape of the wire is deformed in a ruptured manner. The wire is bent at this place. Therefore, the part shown by an arrow becomes weak against vibration and impact. Then, the weak part of the bonded part 4 is made to be a structure of a hard molding agent 1. The entire exposed part of the wire 3 is made to have a structure of a soft molding agent 2. As the hard molding agent, Pelcoat XC-1914-1 (trade name) is used. As the soft molding agent, Shin-etsu silicon K66 (trade name) is used.
申请公布号 JPS62186553(A) 申请公布日期 1987.08.14
申请号 JP19860028542 申请日期 1986.02.12
申请人 SEIKO EPSON CORP 发明人 SUZAWA KIMITAKA
分类号 H01L23/28;H01L23/29;H01L23/31 主分类号 H01L23/28
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