发明名称 PARTIAL PLATING METHOD
摘要 PURPOSE:To prevent the irregularity at the boundary between a non-plating layer and electroplating layer by exposing and developing a photosensitive film on a substrate via a positive film to form an insulating photosensitive film then subjecting the film to chemical plating and electroplating. CONSTITUTION:The photosensitive film 12 is laminated on the resin substrate 11 and the positive film 13 is stuck onto said film. The photosensitive film 12 is exposed from above and while the positive film 13 is held removed, the film is developed to form the insulating photosensitive film 14. The chemical plating layer 16 of copper, etc., is formed on an exposed surface 15 of the substrate 11 and further the electroplating layers 17 consisting of a copper layer 18, a nickel layer 19, a chromium layer 20, etc. are successively laminated thereon. The film 14 is finally removed by using an aq. sodium hydroxide soln. The appearance of the partial electroplating on the substrate consisting of an ABS resin or polycarbonate resin to be used for external parts of an automobile is improved by the above-mentioned method.
申请公布号 JPS62185895(A) 申请公布日期 1987.08.14
申请号 JP19860027425 申请日期 1986.02.10
申请人 MITSUBISHI MOTORS CORP 发明人 IKEDA NORIO;UOTANI TAKESHI;MATSUMURA SHIGEKI
分类号 C25D5/56;C25D5/02 主分类号 C25D5/56
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