| 摘要 |
PURPOSE:To prevent a semiconductor element from static electricity breakdown by a method wherein all wirings are shortcircuited since a package is engaged with a conductive frame so that the package may be supplied with current from any potential element through the intermediary of the sides of said conductive frame. CONSTITUTION:A ceramic package 11 is engaged with a box type conductive frame 12 covering the surface and sides of edges of the package 11 to be removed at any time. The conductive frame 12 made of conductive rubber etc. say silicon resin mixed with metallic particles such as silver (Ag), copper (Cu), carbon (C) etc. or any other conductive material particles is naturally conductive and elastic. The conductive frame 12 formed of elastic material is engaged with the ceramic package 11 by means of pressure fitting and the like to be removed at any time. Sufficient thickness is 0.5-1mm.. Through these procedures, all internal wirings may be shortcircuited making all potential even. |
