| 摘要 |
PURPOSE:To eliminate strain yielded in the vicinity of an interface between a GaAs substrate and a passivation film, by a structure wherein a pellet is fixed and then metal wires are bonded, and thereafter the passivation film is formed. CONSTITUTION:A pellet 1 comprises an active layer on its surface, electrodes 4 and a GaAs substrate, on the surface of which a heat radiating electrode is formed. The pellet 1 is fixed to a package comprising copper and the like with a fixing material 2. An outer lead 5, which is provided on the package 3, and the electrodes 4 on the pellet 1 are connected with thin metal wires 6 comprising Au and the like. A passivation film 7 comprising SiO2 is formed on the entire surface of the pellet 1 including the electrodes 4, to which the thin metal wires 6 are connected. Since the passivation film 7 is deposited after the pellet 1 is fixed and the thin metal wires are bonded, strain is not yielded in the passivation film 7.
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