| 摘要 |
PURPOSE:To perform positioning more accurately than in a conventional method at a low cost, by forming positioning holes in a lead frame in the same process of forming the lead frame. CONSTITUTION:Positioning holes 2 in a lead frame forming a package are provided in a process forming the lead frame. Ceramic substrates 3 and 4 are bonded with a bonding agent so as to hold said lead frame. As a result, the positioning is performed by using the holes provided in the lead frame. Since the holes are formed in the metal, the positioning of the package and a substrate to be packaged can be performed vary accurately. |
