发明名称 FORMATION OF STEREOSCOPIC PATTERN BY ELECTROPLATING
摘要 PURPOSE:To exactly form a fine stereoscopic pattern with high accuracy by forming a resist layer on a metallic surface, subjecting the layer to exposing and developing treatments to form a pattern, then selectively electrodepositing a metal thereon. CONSTITUTION:The photoresist layer 2 consisting of a photosensitive resin is formed on the surface of a metallic product 1 and a film 3 for baking formed with a desired pattern is placed thereon. UV rays 4 are irradiated through the film 3 on to form the cured resist layer 6 and uncured resist layer 7. Such material 8 to be treated is immersed in a developing soln. to dissolve the uncured resist layer 7 and to form a patterned resin layer 9. A material 8 to be treated is then subjected to electroplating to electrodeposit the metal 10 only on the exposed metallic part. An ornamental plating layer 11 is formed on the surface of the electrodeposited metal 10. The material to be treated is finally immersed into a stripping liquid to dissolve away the cured resist layer 6. A projecting metallic pattern layer 12 consisting of the electrodeposited metal 10 is thus formed.
申请公布号 JPS62185892(A) 申请公布日期 1987.08.14
申请号 JP19860027490 申请日期 1986.02.10
申请人 KURIHARA TOKIN KOJO:KK 发明人 KANETANI AKIRA;KURIHARA KENICHI
分类号 C25D5/02 主分类号 C25D5/02
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