| 摘要 |
PURPOSE:To prevent the contacts of adjacent bonding wires by arranging the pairs of mutually corresponding internal leads and bonding pads so as to be positioned on a straight line from the center of a semiconductor chip at every pair. CONSTITUTION:A semiconductor chip 3 is die-bonded with the central section of a cavity 1A in a package 1 for a semiconductor device, and internal leads 2, 2' are formed to the peripheral section of the package 1 surrounding the chip 3. Bonding pads 4 corresponding to each lead 2 at the central section of respective side of the package 1 are shaped on a circumference centering around the center 6 of the chip 3 on the chip 3. The pairs of mutually leads 2 and pads 4 are disposed so as to be positioned on a straight line from the center 6 at every pair. The same applies to the relationship of the leads 2' formed at the corner sections of the package 1 and the bonding pads 4'. Accordingly, the mutually adjacent leads 2' shape the same angles as ones formed by the mutually adjacent leads 2, thus preventing the extreme narrowing of intervals among adjacent bonding wires 5, 5. |
