| 摘要 |
PURPOSE:To prevent the reception of stress due to differential thermal expansion and the cure shrinkage of a sealing resin of a chip, etc. by forming a cavity between the chip, etc. and the resin by softening and breaking a thermal expansion substance mixed to a rubber by heat. CONSTITUTION:A chip 4 is fixed to a die pad 3, entire assembly is completed, an Si rubber 5 into which micro-capsules 8 are mixed is attached to one part or the whole circumference of the chip 4, and the rubber 5 is cured. The capsules 8 are heated up to a temperature where they are expanded, and the whole is expanded. The whole is sealed by using an epoxy resin 6. Since the chip 4, etc. are coated previously with the rubber 5 at that time, the resin 6 is brought into contact with the rubber 5, thus preventing direct contacts among the chip 4, etc. and the resin 6. The whole is heated, and the capsules 8 are softened. The outer walls of the capsules 8 are shrunk and broken by heat at that time, and the capsules 8 are fused and coagulated mutually. Accordingly, a cavity 7 is shaped to the section of the chip 4, etc., thus eliminating the effect of the resin 6 on the part. |
