| 摘要 |
PURPOSE:To enable secure wire bonding regardless of the deformation of leads of a lead frame or the difference in thickness by a method wherein the leads of the lead frame are enabled to be fixed by means of a tapered surface and a pressing member. CONSTITUTION:A recess is provided at the center in the upper part of a heat block 19, and a fixed block 20 is buried in the recess. The surface of this block 20 is provided with the tapered surface 21, which inclines outward at an angle of theta. This tapered surface 21 abuts against the leads of the lead frame 1, and accordingly the leads are pushed up. On the other hand, the upper surface of the lead frame 1 is fixed by means of the pressing member 2. Since this manner enables bonding in the state of the correction of lead deformation, the bondability can be improved. Besides, the leads which cannot be pressed by the pressing member can be also fixed because of the thickness of the lead; therefore the bondability can be improved. |
