| 摘要 |
<p>A semiconductor device wherein an integrated circuit which receives a signal transmitted from a drive circuit has a pair of package leads of which the outer ends are electrically connected to a transmission line of the drive side and to a transmission line of the terminal side, respectively. The inner ends of the pair of package leads are electrically connected to pads on the chip, respectively. A terminal resistance and the package lead that is connected to the transmission line of the drive side may be connected to the pads on the chip.</p> |
