发明名称 Power semiconductor module
摘要 The invention proposes that external connections, for example control connections (13) and especially so-called externally located connections, be provided with a plug connection (10, 12). In consequence it is not possible to insert connecting elements (11) for external connections (13) into a housing (1) until a fitted and soldered substrate (2) has been inserted. As an alternative to this modular design, it is proposed to solder connecting elements (11) into the housing (1) at a relatively low soldering temperature, in a second soldering step, after the substrate (2) has been bonded in. <IMAGE>
申请公布号 DE3604313(A1) 申请公布日期 1987.08.13
申请号 DE19863604313 申请日期 1986.02.12
申请人 BROWN,BOVERI & CIE AG 发明人 BAYERER,REINHOLD,DIPL.-ING.DR.
分类号 H01L23/495;H01L23/498;H05K3/34;(IPC1-7):H01L23/48;H01L21/50;H01L25/04;H01R9/09;H01R23/72 主分类号 H01L23/495
代理机构 代理人
主权项
地址