摘要 |
The invention proposes that external connections, for example control connections (13) and especially so-called externally located connections, be provided with a plug connection (10, 12). In consequence it is not possible to insert connecting elements (11) for external connections (13) into a housing (1) until a fitted and soldered substrate (2) has been inserted. As an alternative to this modular design, it is proposed to solder connecting elements (11) into the housing (1) at a relatively low soldering temperature, in a second soldering step, after the substrate (2) has been bonded in. <IMAGE> |