RESIN COMPOSITION WHICH CAN GIVE CURED PRODUCT EXCELLENT IN HEAT RESISTANCE AND ELECTRICAL INSULATING PROPERTY

摘要

PURPOSE:To form a resin composition which can be cured quickly by a relatively simple operation and can give a cured product which has such excellent heat resistance that it is stable at temperatures >=250 deg.C and is excellent in electrical insulating property, by mixing a reaction product of a specified epoxy compound with allylphenol with a polymaleimide compound. CONSTITUTION:This resin composition contains a reaction product (A) obtained by reacting an epoxy compound having at least two glycidyl groups in the molecule with 0.2-5mol, per equivalent of the epoxy groups of this epoxy compound, of an allylphenol and a polymaleimide compound (B). Although o-, m- and p-allylphenols can be used alone or in the form of a mixture as said allylphenol, o-allylphenol is desirable. The mixing ratio of component A to component B is preferably such that 0.8-3 equivalents of the maleimide groups are preset per equivalent of the allyl groups preset in component A.