| 摘要 |
PURPOSE:To easily control a heating temperature, and quickly execute heating and cooling, by executing the heating and cooling of a product by a direct heating floor and a direct cooling floor. CONSTITUTION:A semiconductor product 100 is placed on a guide rail 14a of an entry of a direct heating floor 10. Subsequently, an abutting surface 43 of a pusher 40 is pressed against the product 100 and pushed out along the rail 14a, and it is transferred slowly into a reducing box 30. In the reducing box 30 which has been filled with hydrogen gas, the product 100 moves on a stainless steel plate 13 of the direct heating floor 10, therefore, it is heated directly and a temperature rises. While it is moving on the direct heating floor 10, soldering of the product 100 is executed, and during that time, the soldered part is reduced by the hydrogen gas, and passive parts are connected quickly and also, exactly. Also, when the product 100 passes through an outlet and extruded to the outside of the reducing box 30 by the pusher 40, the product 100 is moved onto a direct cooling floor 20 along a guide rail 24a, and cooled quickly therein. |
