| 摘要 |
PURPOSE:To obtain a sealing resin composition excellent in moisture resistance, low in stress and free of cracking, by mixing an epoxy resin with a dicyclopentadiene/phenol polymer and an inorganic filler at a specified proportion. CONSTITUTION:A resin composition containing an epoxy resin (A) and a dicyclopentadiene/phenol polymer (B) of formula I (wherein R is a group of formula II and m and n are each >=0) as a resin component and further containing 20-90wt%, based on the resin composition, inorganic filler (C). Said composition may suitably contain, if necessary, a mold release such as wax or an acid amide, a flame retardant such as chlorinated paraffin or antimony trioxide, a colorant such as carbon black or red iron oxide, a cure accelerator, etc. It is preferable that said resin composition has an equivalent ratio of the epoxy groups (a) of the epoxy resin to the phenolic hydroxyl groups (b) of the dicyclopentadiene/phenol polymer in the range of 0.10-10.
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