| 摘要 |
Disclosed are a multilayer wiring board and a method of manufacturing the same, in which circuits are multilayered using as an insulating material a sintered compact of an oxide mixture obtained by mixing a glass material powder and an inorganic oxide powder so that the inorganic oxide powder may amount to 30 - 50 wt.% of the whole powdery mixture consisting of it and the glass material powder, the glass material powder having a composition of 20 - 30wt.% of SiO2, 18 - 25wt.%, of Al2O3, 18 - 20 wt.% of B2O3, 1 - 6 wt.% of ZnO, 18 - 28 wt.% of BaO, and 1 - 8 wt.% of MgO and Cao in total, and having a mean particle size of 2.0 - 4.0 mu m, the inorganic oxide powder consisting of an Al2O3 powder having a mean particle size of 2.0 - 4.0 mu m and a ZrSiO4 powder having a mean particle size of 2.0 - 4.0 mu m. The multilayer wiring board sintered at a low temperature has a high flexural strength and a high adhesion strength of soldering. |
