发明名称 CURABLE RESIN
摘要 PURPOSE:To obtain the titled resin which can be easily produced and gives a cured product excellent in heat resistance and mechanical strength, by bonding a specified epoxy resin/phenol adduct with an unsaturated monohydroxyl compound through a diisocyanate. CONSTITUTION:An epoxy resin having at least two epoxy groups in the molecule, such as a compound of formula I, is reacted with a monohydric phenol at an epoxy group to OH group molar ratio of about 1 to obtain an epoxy resin/phenol adduct (A) having at least two OH groups and at least two aryloxymethylene groups in the molecule, such as a compound of formula II. A unsaturated monoepoxy compound having one unsaturated group and an epoxy group in the molecule (e.g., glycidyl methacrylate of formula III) is reacted with an approximately equimolar amount of (meth)acrylic acid to obtain an unsaturated monohydroxyl compound (B) having two unsaturated groups and one OH group in the molecule, such as a compound of formula IV. An addition reaction of component A or component B with a diisocyanate (C) such as 2,4-tolylene diisocyanate is effected, and the obtained adduct is reacted with component B or component A to obtain the titled resin of formula V or the like.
申请公布号 JPS62184010(A) 申请公布日期 1987.08.12
申请号 JP19860025692 申请日期 1986.02.10
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 TAKIYAMA EIICHIRO;ARAI MICHIAKI;ARAI TAKAO
分类号 C08F299/06;C08F290/00;C08G18/67 主分类号 C08F299/06
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