| 摘要 |
PURPOSE:To prevent the adhesion of dust to a wafer, by providing a semiconductor wafer mounting apparatus and an apparatus consisting of a filter part blowing out clean air to a horizontal direction and a blower guiding said clean air to the filter part. CONSTITUTION:A clean air blow-out apparatus 24 consisting of a filter part 22 blowing out clean air to a horizontal direction and a blower 23 supplying said clean air to the filter part is provided to the position opposed to a worker 8 of a manufacturing apparatus 6. A clean air stream is generated along the surface of a wafer 21 as shown by an arrow by the clean air blow-out apparatus 24. By forming said air stream, the dust generated from the worker 8 is made to flow to a passage part without being adhered to the wafer 21. Further, if the manufacturing apparatus 6 generates dust, said dust is rapidly removed without being stagnated in the wafer treating area.
|
