| 摘要 |
PURPOSE:To obtain a molding material which has a relaxed internal stress and does not undergo lowering in moisture resistance, by mixing an epoxy resin with a reaction product formed by bonding a plurality of silicone compounds having different functional groups through their functional groups. CONSTITUTION:An epoxy resin molding material containing a silicone reaction product formed by reacting a plurality of silicone compounds having different functional groups through the functional groups. As the epoxy resin used, a novolak epoxy resin having an epoxy equivalent <=300 and a decreased content of contaminant ions, such as Na<+> and Cl<->, corrosive to semiconductor elements, etc., to the lowest possible degree is the most desirable in respect of moisture resistance, etc. At least two silicone compounds having any of an amino group, a hydroxyl group, a carboxyl group and an epoxy group as said functional group are usually mixed. The amount of said silicone reaction product added is preferably 0.5-30pts.wt. per 100pts.wt. resin.
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