| 摘要 |
PURPOSE:To facilitate the detection of poor soldering of an electronic part by application of pressure from the outside in the inspection of soldering after the electronic part is connected to a printed board, by reducing the rigidity of a lead without weakening the connecting strength of the lead. CONSTITUTION:This electronic part is composed of the following parts: a lead soldering part 8, which is soldered to a printed board and has a large width; a narrow part 22 of the lead, where the width of the lead is made small in order to reduce the rigidity of the lead; a ceramic package 24, which has electronic circuits in the inside; and a lead brazed part 23, where the ceramic package and the lead are brazed with metal. Since the rigidity of the narrow part 22 of the lead is small, the lead, which is not soldered, can be vibrated with a small force when the soldering is inspected after the soldering with the printed board. The detection of the poor soldering of the lead becomes easy. The detection can be performed without breaking the soldered part or the metal brazed part due to the application of an excessive force. |
