发明名称 COLD-CURING COMPOSITION
摘要 PURPOSE:To obtain the titled composition suitable as a sealing material, by reacting a specific polyoxyalkylene terminal-blocked with epoxy group, a siloxane containing amino group and an organic silicon compound and compounding the resultant polyoxyalkylene with an inorganic filler, etc. CONSTITUTION:The objective composition is composed of (A) 100pts.(wt.) of a polyoxyalkylene having hydrolyzable group at molecular chain terminal and siloxane bond in molecular chain and produced by reacting (i) a polyoxyalkylene of formula I (R<1> and R<2> are bivalent hydrocarbon group; n is 10-500) having molecular terminals blocked with epoxy groups, (ii) a siloxane of formula II (R<3> is H or univalent hydrocarbon group; R<4> is bivalent hydrocarbon group; R<5> is univalent hydrocarbon group; m is 1-50) having two amino groups in a molecule and (iii) an organic silicon compound of formula III (R<6> is R<3>; R<7> is R<4>; R<8> is R<5>; X is hydrolyzable group; a is 1-3) having amino group and hydrolyzable group, (B) 3-300pts. of an inorganic filler and (C) 0.001-20pts. of a curing catalyst.
申请公布号 JPS62181321(A) 申请公布日期 1987.08.08
申请号 JP19860023485 申请日期 1986.02.05
申请人 TOSHIBA SILICONE CO LTD 发明人 ZENBAYASHI MICHIO;SHIMIZU CHIYUKI;NAGAOKA HISAYUKI;YOSHIDA TAMIO
分类号 C08G77/48;C08G59/00;C08G59/50;C08L63/00 主分类号 C08G77/48
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