发明名称 BUMP FORMING METHOD
摘要 PURPOSE:To make the shape of a bump constant so as to avoid poor bonding, by vibrating either a capillary or a part to be bonded, decreasing the strength of a piece of wire at a part directly over a ball, and cutting the wire, where the strength is decreased. CONSTITUTION:A ball 4 is formed at the tip of a piece of wire 2, which is inserted in a capillary 11. The capillary 1 is lowered, and the ball 4 is compressed and bonded to a part to be bonded. Thereafter the capillary 1 is lifted, and at least either the capillary 1 or the part to be bonded 6 is vibrated. Then the strength of a part 4a of the wire 2 directly over the ball 4 is decreased. Then the wire 2 is pulled and cut at a part, where the strength is decreased. Thus, the light of the wire 2 remaining at the ball 4 is made constant. Therefore the length of the wire 2 remaining on a bump 12 can be made constant at a sufficiently short state. Thus the bonding strength between the bump 12 and an external terminal can be made constant, and poor bonding is avoided.
申请公布号 JPS62181449(A) 申请公布日期 1987.08.08
申请号 JP19860023458 申请日期 1986.02.05
申请人 TOSHIBA CORP 发明人 ANDO TETSUO;ATSUMI KOICHIRO
分类号 H01L21/60 主分类号 H01L21/60
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