| 摘要 |
PURPOSE:To easily form a rugged copper plating layer having good adhesiveness by repenishing the copper-component of the amt. equal to the amt. deposited on the plating layer at proper times by cuprous oxide and cupric oxide in the stage of forming the rugged plating layer on the surface of a heat transmission member by using a metallic copper plating liquid added with a specific additive. CONSTITUTION:The plating liquid 9 is circulated by a device combined with a cap 12 and a circulation pump 13 to the inside of the straight pipe heat transmission member 2' for a heat exchanger fixed with radiation fins on the outside circumference. Electricity is conducted from a DC power source 14 to an anode bar 15 inserted into the heat transmission member 2' and a connecting terminal 16 to form the plating layer on the inside of the heat transmission member 2'. The metallic copper plating liquid added with a oxyethylene surface active agent and chloride ions of a low concn. as the additive is used for the plating liquid 9 in this stage. Since the copper ions in the plating liquid 9 are successively decreased by the deposition of the plating layer, the mixture composed of the cuprous oxide and curpic oxide contg. the copper- component of the amt. corresponding to the amt. deposited on the plating layer is properly added to the plating liquid 9. The plating layer having the excellent adhesiveness is thus easily formed in mass production.
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