| 摘要 |
PURPOSE:To reduce air flow resistance of forcible air cooling and to attach many leads by providing external leads having different shapes on both side surfaces of an LSI package body to sink and mount the leads on a printed substrate. CONSTITUTION:A plurality of flat package type external leads 2 are attached to one side surface of an LSI package body 1, and a plurality of leadless package type external leads 3 are attached to the other side opposite surface to which the leads 2 are attached. The package body 1 is mounted in the mounting hole 41 of the package of a formed printed substrate 4, and the leads 2, 3 are soldered to corresponding connection patterns 42, 43. Since the package is projected from the substrate 4 by mounting the package, it does not disturb an air stream 5. |
